Description
Solder Paste Type
|
合金成分 Alloy Composition |
熔化温度 Melting Point (℃) |
形状 Form |
用途 Uses |
|||||
|
固相线 Solldus |
液相线 Liquidus |
膏 Paste |
形状 Bar |
线 Wire |
球 Ball |
预成型片 Preform |
||
|
Sn99/Ag0.3/Cu0.7 |
217 |
227 |
● |
● |
● |
|
|
A E |
|
Sn98.5/Ag1.0/Cu0.5 |
217 |
227 |
● |
● |
● |
|
● |
A E |
|
Sn96.5/Ag3.0/Cu0.5 |
217 |
220 |
● |
● |
● |
● |
● |
ADE |
|
Sn95.5/Ag4.0/Cu0.5 |
217 |
220 |
● |
● |
● |
|
|
DE |
|
Sn/Ag3.0/Cu0.5/Ni/Ge |
217 |
219 |
● |
● |
● |
|
● |
DE |
|
Sn96.5/Ag3.5 |
221 |
221 |
● |
● |
● |
● |
|
ADE |
|
Sn42/Bi58 |
138 |
138 |
● |
● |
● |
● |
|
ABE |
|
Sn/Bi57/Ag |
139 |
139 |
● |
● |
● |
● |
|
BE |
|
Sn64/Bi35/Ag1 |
138 |
187 |
● |
● |
|
|
|
BDE |
|
Sn95/Sb5 |
235 |
240 |
● |
● |
|
|
|
CE |
|
Sn10/Pb88/Ag2 |
268 |
302 |
● |
● |
|
● |
|
C※1 |
|
Sn63/Pb37 |
183 |
183 |
● |
● |
|
● |
● |
ABD |
|
Sn62/Pb36/Ag2 |
179 |
179 |
● |
● |
● |
● |
● |
AD |
|
Sn62.8/Pb36.8/Ag0.4 |
179 |
183 |
● |
● |
● |
|
|
AD |
Note:
① “●”means use a lot.
② A: Common ordinary solder alloys; B: Suitable for the soldering radiators and low temperature soldering thermal sensitive element; C: Suitable for semiconductor chip and other high temperature soldering; D: Suitable for hole soldering; E: Suitable for Lead-free soldering
③ ※1: Usually used in high power semiconductor chip internal soldering, it is ROHS exempt product.
Currently Yuguang manufacture Sn63Pb37, YG-SAC305, YG-SAC105, YG-SAC0307, Sn42Bi58 soldering alloys, which have the highest utilization rate on the market. We also can make solder alloys accordingly the customer's requirement.
Storage of solder paste
Solder paste should be sealed in constant temperature and humidity special refrigerators, and the lead and lead-free should be stored separately. The storage temperature is approximately between 0 ° C to 10 ° C. If the temperature is high, the alloy solder powder will react chemically with the flux, increasing the viscosity and affecting the printing and soldering performance; if the temperature is low (below 0 ° C), the rosin in the flux will produce crystallization phenomenon, deteriorating the solder paste shape, thus will affecting the rheological characteristics of solder paste.
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